Global Design Forum: The Future of Packaging symposium.
Part of the Circular Design Series in partnership with SAP, 23 May 2023, New York.
This session inspected the capabilities and limitation of materials and approached questions like, how do these materials perform under heat, moisture and how can they be used at scale and globally? What is the demand as well as potential to recycle or for a second life? How do designers work with these materials while still fulfilling packaging requirements?
Andrew Dent, Executive VP Research, Material ConneXion
Melissa LaCasse, Co-founder, Tanbark
Cyrill Gutsch, Founder and CEO, Parley for the Oceans
Moderator: Liz Alessi, Advanced Sustainability Consultant
About the Circular Design Series
Once you start thinking about circular design, it is possible to see everywhere. Consider the Circular Design Series itself, even. Soft launched by SAP in 2018 at London Design Festival, the Plastics Cloud was more of a provocation, aiming to inspire action around the challenge posed by plastic waste.
That evolved into a physical space for dialogue in 2019, created in collaboration with the Ellen MacArthur Foundation. The pandemic curtailed physical engagement in 2020, but supercharged the conversation and launched the Circular Design Project in earnest. The virtual talk series spanned a variety of subjects, from fashion and the built environment, to food design and material innovation.
Going strong two years on, Global Design Forum has now leaped across the pond to New York, with a renewed focus on plastics, and in particular, packaging.